Packaging structure and packaging method of solar battery chip

太阳能电池芯片封装结构及其封装方法

Abstract

一种太阳能电池芯片封装结构及其封装方法,是将至少一太阳能电池芯片设置于基板上,并将高透光性的胶合填充材料层形成于基板的上表面的外部周围,再将中空间隔层设置于太阳能电池芯片与胶合填充材料层之间,使太阳能电池芯片位于中空间隔层的内孔,将透明遮盖设置于中空间隔层与胶合填充材料层的上方,并与太阳能电池芯片间具有一空间,而使基板、透明遮盖与中空间隔层形成有空气室,最后加压使胶合填充材料层发生胶合,将基板与透明遮盖黏合。可解决太阳能电池模块在户外长期曝晒时,胶合填充材料层因受热质变,而使模块发电效能降低的问题。
The invention discloses a packaging structure and a packaging method of a solar battery chip. The method comprises the following steps of: firstly, arranging at least one solar battery chip on a substrate, and forming a high-photopermeability gluing filling material layer on the periphery of an upper surface of the substrate; secondly, arranging a hollow spacing layer between the solar battery chip and the gluing filling material layer to make the solar battery chip positioned in an inner hole of the hollow spacing layer, arranging a transparent cover above the hollow spacing layer and the gluing filling material layer, and forming a space between the transparent cover and the solar battery chip to form an air chamber among the substrate, the transparent and the hollow spacing layer; and finally, pressurizing to make the gluing filling material layer glued so as to adhere the substrate to the transparent cover. By the invention, the problem that the power generation efficiency of a solar battery module is reduced because of qualitative change of the heated gluing filling material layer when the solar battery module is exposed outdoors for a long time can be solved.

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