板加强结构、板组件、以及电子装置

  • Inventors:
  • Assignees: 富士通株式会社
  • Publication Date: December 14, 2011
  • Publication Number: CN-102281715-A

Abstract

本发明涉及板加强结构、板组件、以及电子装置。公开了一种板加强结构,该板加强结构用于加强将电子部件安装在第一表面上的电路板,所述电子部件具有设置在所述第一表面上的矩形区域中的电极。所述板加强结构包括:加强部件,该加强部件接合至所述电路板的第二表面上的、与所述矩形区域的四角的角部相对应的位置,所述第二表面设置在与所述电路板的所述第一表面相反一侧上。在所述板加强结构中,在与所述矩形区域的所述四角的角部相对应的位置处形成对应缺口,并且所述缺口形成所述加强部件的、朝向外侧的至少两个顶点,以形成所述板加强结构的轮廓。
The present invention relates to a board reinforcing structure, a board assembly, and an electronic device. Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.

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Patent Citations (4)

    Publication numberPublication dateAssigneeTitle
    CN-101366325-AFebruary 11, 2009松下电器产业株式会社Electronic component mounting structure
    JP-2000151083-AMay 30, 2000Nec Saitama Ltd, 埼玉日本電気株式会社Enforcing structure for ic package
    JP-2006269772-AOctober 05, 2006Nec Saitama Ltd, 埼玉日本電気株式会社半導体パッケージ、配線基板、及び半導体装置
    US-2002007964-A1January 24, 2002International Business Machines CorporationPrinted circuit board and electronic package using same

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